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Vision Datum  |  SKU: BTL-0.398X-318-150M(LM)
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BTL-150M 90° Turning Telecentric Lens for Semiconductor Inspection | Φ67.8mm

$4,800.00 $5,445.00
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FAQ

Q: What is the advantage of a 90° turning telecentric lens?
A: The 90° optical path design allows flexible installation in space-constrained equipment while maintaining accurate, low-distortion telecentric imaging.

Q: What sensor size does the BTL-150M series support?
A: The series supports image circles up to Φ67.6 mm, making it suitable for large-format, high-resolution industrial cameras.

Q: What working distance options are available?
A: Multiple working distances are available, including 288 mm, 330 mm, 338 mm, 372 mm, and 465 mm, allowing flexible system integration.

Q: Why use a telecentric lens for precision measurement?
A: Telecentric optics minimize perspective error and distortion, ensuring accurate measurements and repeatable inspection results.

Q: What applications are the BTL-150M series suitable for?
A: It is ideal for wafer inspection, semiconductor packaging, substrate measurement, lead frame inspection, and precision metrology.

Q: What optical performance does the lens provide?
A: The series delivers excellent image quality with MTF30 at 100 lp/mm, enabling detection of fine patterns and micro-defects.

Q: Is the BTL-150M suitable for compact machine vision systems?
A: Yes. Its 90° turning design makes it ideal for multi-axis mechanisms and inspection stations with limited installation space.

BTL-150M SERIES Telecentric Lens

Product Description

BTL-150M SERIES 90° Turning Telecentric Lens is a high-performance telecentric lens designed for precision machine vision inspection where installation space is limited. With its 90-degree optical path turning design, it enables flexible integration inside compact equipment, multi-axis mechanisms, and confined inspection stations while maintaining stable and distortion-controlled imaging.

This series supports a maximum sensor size of Φ67.6mm, making it ideal for large-format, high-resolution industrial cameras. To fit different mechanical structures and inspection distances, multiple working distance (WD) options are available: 288mm / 330mm / 338mm / 372mm / 465mm, allowing engineers to optimize optical layout and system integration.

In terms of optical performance, the BTL-150M series delivers excellent high-frequency resolution with Max. MTF30 & 100 lp/mm, ensuring sharp detail reproduction for fine patterns, micro-defects, and precise edge detection. It is especially suitable for demanding applications in the semiconductor industry, including wafer inspection, package inspection, substrate measurement, lead frame inspection, and other high-accuracy metrology tasks.

Key Features & Benefits

  • 90° Turning Design: ideal for space-limited machine vision integration
  • Large Sensor Support (Φ67.6mm max.): enables large FOV and high-resolution imaging
  • Multiple WD Options (288–465mm): flexible for different inspection setups
  • High Resolution Performance: Max. MTF30 & 100 lp/mm for fine detail detection
  • Telecentric Imaging Advantage: minimizes perspective error for precision measurement

Specifications

Φ67.6mm M72-Mount 90 Degree Turning Telecentric Lens

Model FOV Mag. WD F/# MTF30
BTL-0.356X-330-150M(LM) (FBL=12mm) Φ190mm 0.356x 330mm±5 F9.4 >95lp/mm
BTL-0.398X-318-150M(LM) (FBL=12mm)
 Φ170mm
0.398x
318mm±5
 F9.4
>88lp/mm
BTL-0.262X-338-150M-L(LM) Φ258mm 0.262x 338mm±5 F8.8 >95lp/mm
BTL-0.225X-465-150M(LM) (FBL=19.5mm) Φ300mm 0.225x 465mm±6 F6.6 >98lp/mm
BTLO3-67-R9E Φ67mm 0.303x 410mm±3 F6.2 >100lp/mm

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